Computer Science > Other Computer Science
[Submitted on 7 May 2008]
Title:Fabrication of 3D Packaging TSV using DRIE
View PDFAbstract: Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch through-silicon via (TSV) for advanced interconnections. The interconnection step can be done prior to or post CMOS manufacturing, each requiring different etch process performances. A review of the DRIE capability in terms of etching profile, etch rate, etch depth has been carried out. Excellent tool flexibility allows a wide range of basic and complex profiles to be achieved. Unlike other techniques, DRIE has the capability to etch feature sizes ranging from sub-micron to millimeter width. The main specificity of the DRIE is that etch rate is sensitive to the total exposed area and the aspect ratio. For the TSV applications, where the total exposed area is lower than 10%, high etch rates are achievable. A study has also been done to highlight the importance of via profile for the success of the refilling step. In addition, due to the high flexibility of DRIE, we also explore the capability of using this technique for wafer thinning and plasma die separation.
Submission history
From: EDA Publishing Association [view email] [via CCSD proxy][v1] Wed, 7 May 2008 09:38:24 UTC (763 KB)
References & Citations
Bibliographic and Citation Tools
Bibliographic Explorer (What is the Explorer?)
Litmaps (What is Litmaps?)
scite Smart Citations (What are Smart Citations?)
Code, Data and Media Associated with this Article
CatalyzeX Code Finder for Papers (What is CatalyzeX?)
DagsHub (What is DagsHub?)
Gotit.pub (What is GotitPub?)
Papers with Code (What is Papers with Code?)
ScienceCast (What is ScienceCast?)
Demos
Recommenders and Search Tools
Influence Flower (What are Influence Flowers?)
Connected Papers (What is Connected Papers?)
CORE Recommender (What is CORE?)
arXivLabs: experimental projects with community collaborators
arXivLabs is a framework that allows collaborators to develop and share new arXiv features directly on our website.
Both individuals and organizations that work with arXivLabs have embraced and accepted our values of openness, community, excellence, and user data privacy. arXiv is committed to these values and only works with partners that adhere to them.
Have an idea for a project that will add value for arXiv's community? Learn more about arXivLabs.