Electrical Engineering and Systems Science > Systems and Control
[Submitted on 2 Oct 2023 (this version), latest version 6 Feb 2024 (v2)]
Title:Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model
View PDFAbstract:Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe thermal issues like temperature escalation, high thermal gradients, and excessive hot spot formation, which may result in degrading chip performance, accelerating device aging, and premature failure. Thermal-Aware Scheduling (TAS) enables the optimization of thermal dissipation to maintain a safe thermal state. In this work, we implement a new TAS algorithm, POD-TAS, which manages the thermal behavior of the cores based on a defined set of states and their transitions. We compare the performances of a dynamic Resistor-Capacitor (RC) thermal circuit simulator (HotSpot) and a reduced order Proper Orthogonal Decomposition (POD)-based thermal model and we select the latter for use in our POD-TAS algorithm. We implement a novel simulation-based evaluation methodology to compare TAS algorithms. This methodology is used to evaluate the performance of the proposed POD-TAS algorithm with high spatiotemporal resolution. Additionally, we compare the performance of a state of the art TAS algorithm, RT-TAS, to our proposed POD-TAS algorithm. Furthermore, we utilize the Clarkson Open-source Multi-physics Benchmark Suite (COMBS) to provide CPU workloads for task scheduling. Our experimental results on a multi-core processor using a set of 4 benchmarks demonstrate that the proposed POD-TAS method can improve thermal performance by decreasing the peak thermal variance by 53.0% and the peak chip temperature by 29.01%. Using a set of 8 benchmarks, the comparison of the algorithms demonstrates that POD-TAS decreases the peak spatial variance of the chip temperature and the peak chip temperature by 29.57% and 26.26% respectively.
Submission history
From: Anthony Dowling [view email][v1] Mon, 2 Oct 2023 02:24:35 UTC (14,985 KB)
[v2] Tue, 6 Feb 2024 16:22:18 UTC (16,034 KB)
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