Condensed Matter > Superconductivity
[Submitted on 19 Oct 2022 (this version), latest version 2 Feb 2023 (v2)]
Title:Self- and Mutual Inductance of NbN and Bilayer NbN/Nb Inductors in Planarized Fabrication Process With Nb Ground Planes
View PDFAbstract:We present measurements of self- and mutual inductance of NbN and bilayer NbN/Nb inductors (microstrips, striplines, serpentines, etc.) with Nb ground plane(s) fabricated in an advanced process node developed for superconductor electronics at MIT Lincoln Laboratory. In this process, the signal traces of logic cell inductors are made either of a 200-nm NbN layer with $T_c$=16 K or of an in-situ deposited NbN/Nb bilayer with 100 /100 nm layer thicknesses, replacing a 200-nm Nb layer M6 in the standard SFQ5ee process with nine superconducting layers on 200-mm wafers. Nb ground planes were preserved to maintain a high level of interlayer shielding and low intralayer mutual coupling. We determined magnetic field penetration depth in the NbN films to be $\lambda$ = 491 +/- 5 nm, corresponding to kinetic inductance of 200-nm films of 1.51 pH/sq. A two-step patterning of the top Nb and the bottom NbN layers of the NbN/Nb bilayer allows to create inductors in a very wide range of linear inductance values, from low values ~ 0.4 pH/$\mu$m typical for Nb geometrical inductors to ~ 35 pH/$\mu$m typical to thin-film kinetic inductors. This is achieved by changing the bilayer linewidth and size of the etched away Nb. Mutual inductance of NbN and Nb inductors, of NbN inductors, and of bilayer inductors is the same as between two Nb inductors with the same geometry and placement between the ground planes, i.e., mutual inductance does not depend on superconducting properties of the signal traces in the studied range of linewidths. Results of the measurements agree with analytical expressions and numerical simulations within a few percent in the studied range of linewidths from 250 nm to 4 $\mu$m. Implementation of NbN and NbN/Nb bilayer inductors allows for a significant increase in the circuit density and integration scale of superconductor digital electronics.
Submission history
From: Sergey Tolpygo [view email][v1] Wed, 19 Oct 2022 16:32:22 UTC (975 KB)
[v2] Thu, 2 Feb 2023 17:55:00 UTC (1,645 KB)
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