Computer Science > Computational Geometry
[Submitted on 17 May 2021]
Title:Topology for Substrate Routing in Semiconductor Package Design
View PDFAbstract:In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, which we call the Circular Frame, is a polygonal schema, which is originally used in topology to study the topological structure of 2-manifolds. We show through experiments that our new routing method based on the Circular Frame competes with certain grid-based routing algorithms.
Submission history
From: Rak-Kyeong Seong [view email][v1] Mon, 17 May 2021 16:40:17 UTC (2,242 KB)
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