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Condensed Matter > Mesoscale and Nanoscale Physics

arXiv:2011.00494 (cond-mat)
[Submitted on 1 Nov 2020]

Title:Reduction of interfacial thermal resistance of overlapped graphene by bonding carbon chains

Authors:Yuwen Huang, Wentao Feng, Xiaoxiang Yu, Chengcheng Deng, Nuo Yang
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Abstract:Exploring the mechanism of interfacial thermal transport and reducing the interfacial thermal resistance is of great importance for thermal management and modulation. Herein, the interfacial thermal resistance between overlapped graphene nanoribbons is largely reduced by adding bonded carbon chains by performing molecular dynamics simulations. And the analytical model (cross-interface model, CIM) is utilized to analyze and explain the two-dimensional thermal transport mechanism at cross-interface. An order of magnitude reduction in interfacial thermal resistance is found as the graphene nanoribbons are bonded by just one carbon chain. Interestingly, the decreasing rate of interfacial thermal resistance slows down gradually with the increasing of the number of carbon chains, which can be explained by the proposed theoretical relationship based on CIM. Moreover, by the comparison of CIM and traditional simplified model, the accuracy of CIM is verified and demonstrated in overlapped graphene nanoribbons. This work provides a new way to improve the interfacial thermal transport and reveal the essential mechanism for low-dimensional materials applied in thermal management.
Subjects: Mesoscale and Nanoscale Physics (cond-mat.mes-hall)
Cite as: arXiv:2011.00494 [cond-mat.mes-hall]
  (or arXiv:2011.00494v1 [cond-mat.mes-hall] for this version)
  https://doi.org/10.48550/arXiv.2011.00494
Related DOI: https://doi.org/10.1088/1674-1056/abc677

Submission history

From: Huang Yuwen [view email]
[v1] Sun, 1 Nov 2020 13:09:22 UTC (833 KB)
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