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Computer Science > Hardware Architecture

arXiv:2008.03124 (cs)
[Submitted on 10 Jul 2020]

Title:Design Space Exploration of Power Delivery For Advanced Packaging Technologies

Authors:Md Obaidul Hossen, Yang Zhang, Hesam Fathi Moghadam, Yue Zhang, Michael Dayringer, Muhannad S Bakir
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Abstract:In this paper, a design space exploration of power delivery networks is performed for multi-chip 2.5-D and 3-D IC technologies. The focus of the paper is the effective placement of the voltage regulator modules (VRMs) for power supply noise (PSN) suppression. Multiple on-package VRM configurations have been analyzed and compared. Additionally, 3D IC chip-on-VRM and backside-of-the-package VRM configurations are studied. From the PSN perspective, the 3D IC chip-on-VRM case suppresses the PSN the most even with high current density hotspots. The paper also studies the impact of different parameters such as VRM-chip distance on the package, on-chip decoupling capacitor density, etc. on the PSN.
Subjects: Hardware Architecture (cs.AR); Signal Processing (eess.SP)
Cite as: arXiv:2008.03124 [cs.AR]
  (or arXiv:2008.03124v1 [cs.AR] for this version)
  https://doi.org/10.48550/arXiv.2008.03124

Submission history

From: Md Obaidul Hossen [view email]
[v1] Fri, 10 Jul 2020 17:56:02 UTC (7,625 KB)
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