Physics > Chemical Physics
[Submitted on 18 May 2014 (this version), latest version 28 Jun 2014 (v2)]
Title:Atomistic Kinetic Monte Carlo Simulations of Polycrystalline Copper Electrodeposition
View PDFAbstract:A high-fidelity kinetic Monte Carlo (KMC) simulation method (T. Treeratanaphitak, M. Pritzker, N. M. Abukhdeir, Electrochim. Acta 121 (2014) 407--414) using the semi-empirical multi-body embedded-atom method (EAM) potential has been extended to model polycrystalline metal electrodeposition. The presented KMC-EAM method enables true three-dimensional atomistic simulations of electrodeposition over experimentally relevant timescales. Simulations using KMC-EAM are performed over a range of overpotentials to predict the effect on deposit texture evolution. Results show strong agreement with past experimental results both with respect to deposition rates on various copper surfaces and roughness-time power law behaviour. It is found that roughness scales with time $\propto t^\beta$ where $\beta=0.62 \pm 0.12$, which is in good agreement with past experimental results. Furthermore, the simulations provide insights into sub-surface deposit morphologies which are not directly accessible from experimental measurements.
Submission history
From: Nasser Mohieddin Abukhdeir [view email][v1] Sun, 18 May 2014 21:53:26 UTC (3,894 KB)
[v2] Sat, 28 Jun 2014 17:06:46 UTC (3,902 KB)
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