Physics > General Physics
[Submitted on 7 Jan 2008]
Title:Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers
View PDFAbstract: In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.
Submission history
From: EDA Publishing Association [view email] [via CCSD proxy][v1] Mon, 7 Jan 2008 15:56:46 UTC (385 KB)
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